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Description
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Manufacturer: Allwin21 Corp.Condition: NewWafer Size: Small~8 inchType: Stand Alone, AtmosphericTemperature: 100~800°C or 450~1250°C. Long time and Higher temperature processes are available. Pls contact us for detail.Lamp Zones: 10 from Jan. 2022Gas Lines: 1 ~ 6 linesOptions: Integrated solid robotic wafer transfer ; SMIF (Standard Mechanical Interface) load port transfer. Add Double O Ring and/or O2 Sensor/Analyzer for O2 sensitive applications and saving GaAs, InP, GaN, GaInP, SiC and other valuable compound material wafers .Chamber Design: Allwin21PowerSum Function: Save valuable compound material wafers.RTP Main Customers: LinkFree Fast Quote: LinkFor many years AG Associates was the dominant manufacturer of RTP systems. It was founded in 1981 and produced the first single wafer RTP system in 1982, the Heatpulse 210. In 1987, it produced the Heatpulse 610. These RTP systems run at atmospheric pressure and rely on a pre-process nitrogen or argon purge prior to wafer processing. They are still being used around the world in manufacturing, R&D and Universities. These RTP systems have a proven track record for reliability and simplicity. Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Processing equipment. Allwin21 is manufacturing the new AccuThermo AW Series Atmospheric Rapid Thermal Processors and Vacuum Rapid Thermo Processors.Compared with traditional RTP systems, Allwin21″s AccuThermo AW RTPs have innovative software and more advanced temperature control technologies to achieve the best rapid thermal processing performance ( repeatability , uniformity and Stability etc.).
Rapid Thermal Process, Rapid Thermal Processing, Rapid Thermal Anneal, Rapid Thermal Annealing, Rapid Thermal Oxidation, Rapid Thermal Nitride, RTA, RTP, RTO, RTN,, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, AG210, AG310, AG 410, AG610, AG 610I, AG Associates, Heatpulse 210, Heatpulse 410, Minipulse 310, Heatpulse 610, Heatpulse 610I, AG Heatpulse 410, AG Heatpulse 610, AG Heatpulse 210, AG Minipulse 310, Atmospheric Rapid Thermal Process, Vacuum Rapid Thermal Process, Furnace, Oven, Thermal Furnace, Thermal Process, Thermal Processing, Heatpulse 4100, Heatpulse 4108, Heatpulse 8108, Heatpulse 8800,
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Packaging
Packing |
Packaging Size |
Package Weight |
1 |
36 x 39 x 70 ( Inches ) |
600 ( Pounds ) |
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Others
Delivery Lead Time |
Minimum Order |
Supply Ability |
6 weeks |
1 |
200 units per year |
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