|
Description
|
Allwin21 Brochures: Rapid Thermal ProcessorsPPT on Why AccuThermo AW 610M RTPVideo on Why AccuThermo AW610M ... More ...
Allwin21 Brochures: Rapid Thermal Processors PPT on Why AccuThermo AW 610M RTPType: The most popular , production proven model of Desktop, Atmospheric, Manual Load/Unload RTP RTA RTO RTN. Q and A on RTP equipment. New Options: Add Double O Ring and/or O2 Sensor/Analyzer for O2 sensitive applications and saving GaAs, InP, GaN, GaInP, SiC and other valuable compound material wafers .Wafer Size: 2 to 4 inch or 3~6 inch, Silicon wafers. Use 3″/4″/6″ Susceptor or wafer carriers for small samples, compound material (GaAs , InP , GaN , SiC , GaInP , Glass , etc.) wafers and wafers with metal thin film on top during RTP process.Controller: Allwin21 unique real time precise Advanced PID Control Technology with Fuzzy Logic Learn capability and Chamber Thermal Data. 0.1millisecond Control!Temperature: Closed-loop temperature control with b are thin 0.010” Dia K type thermocouple (150-840C) and Non-Contact Patented ERP pyrometer (Option,400-1250C) . 0-0.25 second quick response for repeatability and precise control! Typical processes are 400-600C for alloy, 700-950C for titanide, compound materials annealing and 1000-1050C for implant annealing Lamp Zones: 6 Zones. Bottom and top heating with 21 (1.2KW ea) Radiation heating lamps. 2400hours-power-on service time! SSR Lamp control instead of traditional TRIAC control.Gas Lines: MFCs, 6 lines capability .Typically, Nitrogen (N2), oxygen (O2), argon (Ar), helium (He) , Forming Gases, NH3, N2O2 etc. are used.Chamber Design: 40-years-proven Heating chamber’s cold-wall design with special scattering gold plating finish ,originated from AG Associates Heatpulse 610. Installation: Customer-installation design. Local engineer installation is optional. PowerSum Function: Save valuable compound material wafers.RTP Main Customers: LinkFree Fast Quote: Link
Rapid Thermal Process, Rapid Thermal Processing, Rapid Thermal Anneal, Rapid Thermal Annealing, Rapid Thermal Oxidation, Rapid Thermal Nitride, RTA, RTP, RTO, RTN,, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, AG210, AG310, AG 410, AG610, AG 610I, AG Associates, Heatpulse 210, Heatpulse 410, Minipulse 310, Heatpulse 610, Heatpulse 610I, AG Heatpulse 410, AG Heatpulse 610, AG Heatpulse 210, AG Minipulse 310, Atmospheric Rapid Thermal Process, Vacuum Rapid Thermal Process, Furnace, Oven, Thermal Furnace, Thermal Process, Thermal Processing, Heatpulse 4100, Heatpulse 4108, Heatpulse 8108, Heatpulse 8800,
Less ...
|
Packaging
Packing |
Packaging Size |
1 |
17 x 30 x 11 ( Inches ) |
|
Others
Delivery Lead Time |
Supply Ability |
4 weeks |
200 units per year |
|
|
|