Model: XDC-2000 Fast Super Dryer Capacity: 1314 Liters Humidity Range: LESS THAN 5% Recovery ...    More ...

Model: XDC-2000 Fast Super Dryer Capacity: 1314 Liters
Humidity Range: LESS THAN 5%
Recovery Time: Recovers to ≤ 5% RH within 30 minutes after accessing door for 30 seconds or less.
External Dimension: 120*193.5*65.5 cm (W*H*D)
Internal Dimension: 110*174*61 cm (W*H*D)
Door Type: Side by Side Glass Door
Lock Type: Standard
Power Consumption: 150 Watts
Hygrometer: German Digital TESTO Thermal Hygrometer

Anti-static, Glass ​Anti-static Paint on Body and Shelves, Anti-static Caster / Stands, ​1 M Ω Ground Wire
 

Effective moisture damage solution that improves yields

Eureka’s ultra-low humidity cabinets are affordable and effective solution in removing moisture in the production process, eliminating moisture related problems without using nitrogen (N2) / dry air purging. Eureka’s Fast Super Dryer dry cabinets can be used as an alternative to baking components and PCBs, eliminating heat baking related problems such as breakdowns of protective coatings, lead oxidation, intermetallic buildup, warping and solder ability. With these problems eliminated, your product reliability and yields will increase.

How does moisture affect SMT production?

• Trace moisture causes failures to moisture sensitive components during high temperature reflow process when the moisture expands rapidly. Common component defects and failures such as micro-cracking, blistering, popcorn effects will occur in moisture sensitive devices when improperly handled and stored. 
• Printed Circuit Boards are hygroscopic. Absorbed moisture will lead to delamination and warping in PCB when moisture inside the layers causes expansion during the reflow process.

​Solving Issues with Traditional Industry Drying Methods Eureka’s dry cabinets, dry boxes, and desiccators will provide ultra-low humidity storage environment conforming to IPC/JEDEC J-STD 033 & IPC-1601, storage and handling standards for MSDs and PCBs.
Eureka Fast Super Dryer also dehumidifies during storage, providing alternative drying methods optimal for removing moisture in all moisture sensitive materials in SMT production, solving all moisture damage problems during reflow process.

• Baking process uses high temperature to dry PCBs which causes breakdowns of protective coatings, lead oxidation, intermetallic buildup and warping that reduces solder ability of circuit boards. 
• Nitrogen and dry air purge is costly and will only provide a storage environment by forcing moisture from the storage cabinet. Nitrogen (N2) purging does not have drying capabilities to remove moisture that has absorbed into the moisture sensitive materials, components or devices.
• Moisture barrier bags (MBBs), requires a vacuum sealer, desiccant packs, humidity indicator cards (HICs) and extra man hours. MBBs are ineffective when improperly sealed.

Features of Eureka Fast Super Dryer’s Ultra-low Humidity Storage:

• Eureka Fast Super Dryers are available in options of <5% RH, <10% RH, <20% RH with fast recovery times.
• Functions in ambient temperature and pressure (NTP) conditions without using costly nitrogen (N2) or dry air purging. 
• Moisture is removed and expelled from the cabinets by the use of desiccant dehumidifiers which automatically regenerates. No fans are required to ventilate.
• Dual hygrometer sensor designs with independent hygrometer monitoring relative humidity levels inside the cabinet.
• Eureka’s Fast Super Dryer will provide moisture sensitive devices indefinite floor-life and resetting shelf life meeting IPC/JEDEC J-STD 033 standards.  
• Eureka’s dry cabinets will provide storage environment meeting IPC 1601 standards optimal for multi-layer Printed Circuit Board / Printed Wire Boards. 
• All of Eureka’s Fast Super Dryer dry cabinets are equipped with anti-static paint, glass, casters and 1M ohm grounding cable meeting IEC-61340-5-1 (ESD) Standard.

For more info visit: http://eurekadrytech.com/high-tech-manufacturing-and-rd-labs
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