Wafer Pre Aligner Feature - Wafer Size (2inch ~ 18inch) - Notch, Flat Wafer, Ring Type, Thin Wafer ...    More ...

Wafer Pre Aligner Feature
- Wafer Size (2inch ~ 18inch)
- Notch, Flat Wafer, Ring Type, Thin Wafer (50um)
- Si, Glass, Film, Sapphire
- Compact Size
- Fast Alignment (< 3.5sec)
- High Performance Accuracy and Repeatability
- Easy to use and Install
- Ethernet , RS-232 Communication
- Auto Detect function of Notch and Flat Type
- Si, Glass, Sapphire Type Simultaneous use
- Wafer Edge Crack and Broken Detect
- 2inch ~ 12inch Simultaneous use (CCD Stage Moving Type)
- Poor Coating and Cracked wafer support alignment
- Crack Point's degree and quantity information output function (max. 500ea)
- Covered Tape at Notch point by Laminator support alignment
 
Wafer Vision Function by CCD
- Compact Embedded System PC (Window XP OS)
- Vision Function and Monitoring
- Easy Monitoring and Capture Screen

 

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