Very Low Profile Copper Film(HVLP) Very Low Profile Copper Film as Very low profile copper foil is an ...    More ...

Very Low Profile Copper Film(HVLP)
 Very Low Profile Copper Film as Very low profile copper foil is an electrolytic copper foil. It has low surface profile, high elongation and tensile strength,high peeling strength and superior heat stability. The company's current very low profile copper foil specifications are mainly 9μm, 12μm and 18μm. The copper foil have uniform thickness and fine micro-crystal structure, which can be widely used in HDI, FPC, PCB, CCL, FCCL and other fields.

Yancheng Tiandi Insulation Co.,Ltd.  
https://www.polyimide-pi.com/polyimide-film-based-fccl.htm
Tel :+86-139-61986280    Fax : +86-515-69011600

Less ...