Ultra-Thin Peelable Copper Foil Ultra-Thin Peelable Copper Foil TD-FEC is ultrathin copper foil produced ... More ...
Ultra-Thin Peelable Copper Foil Ultra-Thin Peelable Copper Foil TD-FECis ultrathin copper foil produced using vacuum sputtering and electro-deposition technology,Mainly used in IC packaging, FPC micro line. Structure and size of copper can be customized. Product Characteristics: 1. Peelable ultrathin copper foil and superior heat stability. 2. Low surface profile,high elongation and tensile strenth.
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